H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/00 (2006.01)
Patent
CA 2621074
A method for metallurigically bonding a metal wire mesh to a metal substrate which allows the use of a fragile open weave mesh and/or a thin wall substrate. A thin nickel based layer is placed between a titanium based substrate and a titanium based wire mesh. The mesh and substrate are lightly clamped in intimate contact against the nickel interlayer therebetween,' e.g., by wire wrapping. The sandwich, or assembly, (i.e., substrate, interlayer, mesh) is then heated to a temperature, below the melting point of titanium and nickel but sufficient to form a eutectic titanium-nickel alloy (e.g. , Ti2Ni).
L'invention porte sur un procédé de soudage d'un treillis métallique sur un substrat métallique permettant d'utiliser un treillis tissé fragile et/ou un substrat à parois minces. A cet effet, on dispose une couche mince de nickel entre un treillis tissé de titane, et un substrat de titane, les deux éléments étant maintenus en contact intime avec la couche intermédiaire de nickel, par exemple par un enveloppe de fils. L'assemblage ainsi constitué est porté à une température inférieure à celle des points de fusion du titane et du nickel, mais suffisante pour former un alliage eutectique de titane/nickel (par exemple de Ti2Ni).
Incumed Llc
Medical Research Products-B Inc.
Smart & Biggar
LandOfFree
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