Method for bonding with dispersion adhesives

C - Chemistry – Metallurgy – 09 – J

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154/141, 117/160

C09J 5/04 (2006.01) C09J 5/02 (2006.01)

Patent

CA 1168939

ABSTRACT A method for bonding with dispersion adhesives, containing organic polymeric material dispersed in particle form in a dispersion medium, in which method the adhesive is applied to at least one of the surfaces of a joint. An additional means for control of the bonding and a possibility of influencing the bonding properties of the adhesive, independent of external factors which influence the drying rate such as temperature, atmospheric humidity, ven-ilation, the absorption properties of the joint surfaces, is obtained by applying to the joint, separate from the application of the adhesive, a coagulating component which is capable of precipitating the particle content of the adhesive to a continuous phase,

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