Method for cleaning a solar cell surface opening made with a...

H - Electricity – 01 – L

Patent

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H01L 31/0224 (2006.01) H01L 31/18 (2006.01)

Patent

CA 2682188

A thin silicon solar cell having a back dielectric passivation and rear contact with local back surface field is described. Specifically, the solar cell may be fabricated from a crystalline silicon wafer having a thickness from 50 to 500 micrometers. A barrier layer and a dielectric layer are applied at least to the back surface of the silicon wafer to protect the silicon wafer from deformation when the rear contact is formed. At least one opening is made to the dielectric layer. An aluminum contact that provides a back surface field is formed in the opening and on the dielectric layer. The aluminum contact may be applied by screen printing an aluminum paste having from one to 12 atomic percent silicon and then applying a heat treatment at 750 degrees Celsius.

L'invention concerne une fine cellule solaire en silicium ayant une passivation diélectrique arrière et un contact arrière avec un champ de face arrière local. Précisément, la cellule solaire peut être fabriquée à partir d'une tranche de silicium cristallin ayant une épaisseur allant de 50 à 500 microns. Une couche barrière et une couche diélectrique sont appliquées au moins sur la surface arrière de la tranche de silicium pour protéger la tranche de silicium de la déformation lorsque le contact arrière est formé. Au moins une ouverture est formée sur la couche diélectrique. Un contact en aluminium qui produit un champ de face arrière est formé dans l'ouverture et sur la couche diélectrique. Le contact en aluminium peut être appliqué par sérigraphie d'une pâte d'aluminium ayant de 1 à 12 pour cent atomique de silicium et par l'application ensuite d'un traitement thermique à 750 degrés Celsius.

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