Method for closing the opening of each of the through- holes...

B - Operations – Transporting – 29 – C

Patent

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18/937

B29C 57/10 (2006.01)

Patent

CA 1274665

ABSTRACT OF THE DISCLOSURE A method is disclosed for closing the opening of each of the through-holes formed in the pipe-wall of a resin pipe and extending parallel to the axis of said pipe. The method comprises pressing one end portion of the pipe in a direction parallel to the axis in a mold for closing the openings, the mold being connected to a high frequency current source. The end portion is then heated by applying a high frequency current to the mold so as to melt the hole-partition walls which partition the through- holes, and the inner surface of the through-holes, thereby closing the openings.

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