C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
C09D 5/08 (2006.01) C23C 22/34 (2006.01) B05D 3/06 (2006.01)
Patent
CA 2426442
The invention relates to a method for coating a metallic surface with a composition. This method is characterised in that the composition contains the following in addition to water: a) at least one organic film former containing at least one polymer which is soluble in water or is dispersed in water; b) a quantity of cations and/or hexafluoro complexes of cations selected from the group comprising titanium, zirconium, hafnium, silicon, aluminium and boron; and c) at least one inorganic compound in particle form with an average particle diameter of 0.005 to 0.2 µm, measured with a scanning electron microscope. The clean metallic surface is brought into contact with the aqueous composition and a film containing particles is formed on the metallic surface. This film is then dried, the dry film having a layer thickness of 0.01 to 10 µm. The invention also relates to a corresponding aqueous composition.
L'invention concerne un procédé pour enduire des surfaces métalliques avec une composition aqueuse. Ce procédé est caractérisé en ce que la composition contient, outre de l'eau, a) au moins un agent filmogène organique qui renferme au moins un polymère hydrosoluble ou dispersé dans l'eau, b) une proportion de cations et/ou de complexes hexafluoro de cations sélectionnés dans le groupe comprenant le titane, zirconium, hafnium, silicium, aluminium et bore, et c) au moins composé inorganique sous forme de particules présentant un diamètre moyen compris entre 0,005 et 0,2 mu m, mesuré sur un microscope électronique à balayage. Ce procédé consiste à mettre en contact la surface métallique propre avec la composition aqueuse, ce qui entraîne la formation d'un film particulaire sur la surface métallique, puis à sécher ledit film, ce dernier présentant à l'état sec une épaisseur de couche comprise entre 0,01 et 10 mu m. L'invention concerne en outre une composition aqueuse correspondante.
Bittner Klaus
Domes Heribert
Jung Christian
Shimakura Toshiaki
Wietzoreck Hardy
Chemetall Gmbh
Robic
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