Method for coating of polyimide by electrodeposition

Details Method for coating of polyimide by electrodeposition Method for coating of polyimide by electrodeposition

C - Chemistry, Metallurgy

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C25D 5/48 (2006.01) C09D 5/44 (2006.01) C25D 9/02 (2006.01) C25D 13/20 (2006.01) H05K 3/02 (2006.01)

Patent

CA 1070262

A METHOD FOR COATING OF POLYIMIDE BY ELECTRODEPOSITION ABSTRACT OF THE DISCLOSURE A method of coating a copper substrate comprises the steps of: anodically microsmoothing the copper sub- strate in an acid bath to provide a substantially smooth surface; electrocoating the microsmoothed substrate with a pin hole free nickel film having a thickness of between about 2.5 microns to about 12.5 microns; single step, non- aqueous electrocoating the microsmoothed, nickel coated sub- strate with a pin hole free polyamic acid polymer, and curing the polyamic acid coating to form a polyimide film free of copper ion contamination.

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