Method for coating surfaces of copper or of a copper alloy...

Details Method for coating surfaces of copper or of a copper alloy... Method for coating surfaces of copper or of a copper alloy...

C - Chemistry, Metallurgy

23

C

C23C 18/28 (2006.01) C23C 18/31 (2006.01) H05K 3/24 (2006.01)

Patent

CA 2326049

Sufficiently good soldering results can not be obtained using known methods for tinning copper surfaces. In particular, the surfaces remain incapable of being soldered after thermal treatment. To eliminate this problem, a method is used for coating surfaces of copper or of a copper alloy with a layer made of tin or of a tin alloy. Said method comprises the essential following steps: a) treating the surfaces with a solution containing at least one noble metal compound in order to deposit noble metal; b) treating the surfaces which are coated with noble metal according to step a) with a solution containing at least one tin compound, at least one acid and at least one complexing agent for copper from the group comprised of thiourea and the derivatives thereof in order to form the tin or tin alloy layer.

Avec les procédés connus permettant d'étamer des surfaces de cuivre, on n'obtient aucun résultat de soudure satisfaisant. En particulier, les surfaces, après leur traitement thermique, ne sont pas aptes à la brasure. Pour éviter ce problème, on met en oeuvre un procédé permettant de recouvrir des surfaces de cuivre ou d'alliage de cuivre avec une couche d'étain ou d'alliage d'étain, lequel comprend les étapes essentielles suivantes: a) traitement des surfaces avec une solution contenant au moins un composé de métal noble, pour y déposer un métal noble; b) traitement des surfaces recouvertes du métal noble selon l'étape a) avec une solution contenant au moins un composé d'étain, au moins un acide et au moins un complexant destiné au cuivre, pris dans le groupe constitué de la thiourée et de ses dérivés, pour former la couche d'étain ou d'alliage d'étain.

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