Method for collectively producing a superimposed element...

Details Method for collectively producing a superimposed element... Method for collectively producing a superimposed element...

H - Electricity

01

L

H01L 23/02 (2006.01)

Patent

CA 2587431

The invention relates to collectively producing superimposed microstructures such as an integrated circuit and a protective cover. The inventive method for collectively producing individual structures each of which comprises superimposed first and second elements consists in preparing the first elements (for example, the chip of an integrated circuit) on a first plate (10), in preparing the second elements (for example, transparent cover) on a second plate (40), in sticking the plates to each other on the large part of the opposite surfaces thereof excluding the gluing of limited areas (ZDn ) devoid of adhesion and in cutting-out individual structures through the top of one part and through the bottom of the other part along different parallel cutting lines (LH1n, LH2n, LDn) passing through the adhesion-free areas in such a way that, after cutting-out, the first elements are provided with surface portions (portions arranged between the parallel cutting lines) which are not covered by the second elements, thereby enabling a bond pad (PLn) to remain accessible in this area. Said invention can be used for producing image sensors or displays covered with a glass wafer and generally for all types of micro-machined structures (MEMS, MOEMS).

L'invention concerne la fabrication collective de microstructures superposées telles qu'un circuit intégré et un capot de protection. On fabrique collectivement des structures individuelles comportant chacune un premier élément et un second élément superposés ; les premiers éléments (exemple : puce de circuit intégré) sont préparés sur une première plaque (10) ; les deuxièmes éléments (exemple : capot transparent) sont préparés sur une deuxième plaque (40) ; les plaques sont collées l'une contre l'autre sur la majeure partie de leurs surfaces en regard, en excluant du collage des zones limitées (ZDn) où il n'y aura pas d'adhérence ; les structures individuelles sont ensuite découpées par le haut d'une part et par le bas d'autre part selon des lignes de découpe parallèles différentes (LH1n, LH2n, LDn) passant dans les zones sans adhérence, de manière qu'après découpe les premiers éléments conservent des portions de surface (celles situées entre les lignes de découpe parallèle) non recouvertes par un second élément ; un plot de connexion (PLn) peut ainsi rester accessible à cet endroit. Application à la fabrication de capteurs d'image ou afficheurs, recouverts d'une plaquette de verre, mais plus généralement aussi à toutes sortes de structures micro-usinées (MEMS, MOEMS).

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