H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/34 (2006.01) B23K 1/005 (2006.01)
Patent
CA 2758752
The invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: - the electrical component or the conductive layer is provided with a soldering material in the area where the component is to be connected to the conductive layer; - the soldering material is provided with energy supplied by an energy source, such that - the soldering material melts and a non-detachable, material-bonded conductive connection between the electrical component and the conductive layer is established.
L'invention concerne un procédé destiné à relier de manière conductrice un composant électrique à au moins une couche conductrice, la couche conductrice étant appliquée sur un substrat essentiellement transparent dans la plage d'onde visible de la lumière, comprenant les étapes suivantes: le composant électrique ou la couche conductrice est pourvu d'une matière de brasage dans la région dans laquelle le composant doit être relié à la couche conductrice; de l'énergie fournie par une source d'énergie est acheminée jusqu'à la matière de brasage de telle manière que la matière de brasage fonde et qu'une liaison conductrice, par complémentarité de matière, inamovible soit formée entre le composant électrique et la couche conductrice.
Albrecht Bernd
Kracht Peter
Nickut Andreas
Gowling Lafleur Henderson Llp
Schott Ag
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