Method for connecting a chip to the antenna of a radio...

G - Physics – 06 – K

Patent

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Details

G06K 19/077 (2006.01) H01L 21/56 (2006.01) H01L 21/60 (2006.01) H01L 23/498 (2006.01) H01L 23/64 (2006.01)

Patent

CA 2418737

The invention relates to a method for connecting a chip (10) to the antenna of a contactless chip card comprising deformable bonding pads (18), said antenna being obtained by printing a conductive ink onto an antenna base (16) made from deformable material. Said method comprises the following steps: positioning the chip (10), which is equipped with bonding pads (12) made of a non-deformable material, on an antenna base so that the bonding pads (12) face the bonding pads (18) of the antenna, and exerting pressure on the chip (10) so that the bonding pads (12) deform both the antenna base (16) and the bonding pads (18) of the antenna under the effect of pressure. Said base (26) and bonding pads (18) remain deformed when the pressure is no longer exerted, thereby enabling a large contact surface to be provided between the bonding pads (12) of the chip (10) and the bonding pads (18) of the antenna.

L'invention concerne un procede de connexion d'une puce (10) sur une antenne de carte a puce sans contact comportant des plots de connexion (18) deformables, l'antenne etant obtenue par impression d'une encre conductrice sur un support d'antenne (16) en materiau deformable. Ce procede comprend les etapes suivantes : positionner la puce (10) munie de plots de connexion (12) en materiau non deformable, sur le support d'antenne de maniere a ce que les plots de connexion (12) soient en regard des plots de connexion (18) de l'antenne, et -exercer une pression sur la puce (10) de fa9on a ce que les plots de connexion (12) deforment le support d'antenne (16) et les plots de connexion (18) de l'antenne sous l'effet de la pression, le support (16) et les plots (18) conservant leur deformation apres que la pression a cesse d'etre exercee, permettant ainsi d'obtenir une surface de contact importante entre les plots de connexion (12) de la puce (10) et les plots (18) de l'antenne. Figure 3

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