Method for connecting substrates and composite element

Details Method for connecting substrates and composite element Method for connecting substrates and composite element

H - Electricity

01

L

H01L 21/50 (2006.01) B81B 7/00 (2006.01) B81C 1/00 (2006.01) C03B 19/00 (2006.01) C03C 4/12 (2006.01) C03C 14/00 (2006.01) C03C 15/00 (2006.01) C03C 17/02 (2006.01) C03C 17/34 (2006.01) C23C 14/10 (2006.01) H01L 21/316 (2006.01) H01L 21/56 (2006.01) H01L 21/768 (2006.01) H01L 23/10 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01) H01L 23/48 (2006.01) H01L 51/52 (2006.01) H01L 23/498 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2485022

The invention relates to a method for connecting substrates (202, 212) comprising electric, semiconductive, mechanical and/or optical components, in addition to a composite element. The method should be substantially material- independent with regard to the substrates to be connected and in addition be suitable for delicate substrates in particular, whilst at the same time exhibiting a high chemical and physical stability and/or creating a hermetic cavity. According to the invention, a raised frame (210a, 210b, 210c, 210d), in particular consisting of an anodically bondable glass, is deposited by vaporisation on one of the two substrates, in order to act as a connecting element.

L'invention se rapporte à un procédé permettant de relier des substrats à des composants électriques, semi-conducteurs, mécaniques et/ou optiques, ainsi qu'à un élément composite. L'objectif de l'invention est de créer un procédé qui peut être utilisé sensiblement indépendamment du matériau des substrats à relier et qui peut en particulier être employé pour des substrats sensibles, et permet de réaliser une liaison présentant une stabilité chimique et physique élevée et/ou de produire une cavité hermétique. A cet effet, un cadre en relief, constitué en particulier de verre pouvant présenter une liaison anodique est métallisé sous vide sur les deux substrats pour servir d'élément de liaison.

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