Method for controlling plating rate in an electroless...

Details Method for controlling plating rate in an electroless... Method for controlling plating rate in an electroless...

C - Chemistry, Metallurgy

23

C

117/77

C23C 18/40 (2006.01) C23C 18/16 (2006.01)

Patent

CA 1223157

ABSTRACT OF THE DISCLOSURE Method for controlling plating in an electroless plating process. The plating rate is continuously monitored. The plating rate is compared with a set point plating rate. A control voltage is derived proportional to the difference in plating rate and the desired plating rate, the integral of the difference, and the derivative of the difference. The control voltage is applied to a replenishment control for controlling the replenishment rate of a constituent chemical of the plating process.

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