Method for creating circuit assemblies

Details Method for creating circuit assemblies Method for creating circuit assemblies

H - Electricity

05

K

H05K 3/46 (2006.01)

Patent

CA 2591095

Provided is a method for preparing a circuit assembly. The method includes (a) applying a curable coating composition to a substrate, the curable coating composition formed from (i) one or more active hydrogen-containing resins, (ii) one or more polyester curing agents, and (iii) optionally, one or more transesterification catalyts; (b) curing the curable coating composition to form a coating on the substrate ; and (c) applying a conductive layer to the surface of at least part of said cured composition. A circuit assembly prepared by the method also is provided.

L'invention concerne un procédé permettant de préparer un ensemble de circuits. Ce procédé consiste : (a) à appliquer une composition de revêtement durcissable sur un substrat, ladite composition étant obtenue à partir (i) d'une ou de plusieurs résines contenant de l'hydrogène actif, (ii) d'un ou de plusieurs agents de durcissement polyester, et (iii) éventuellement, d'un ou de plusieurs catalyseurs de transestérification ; (b) à durcir la composition de revêtement durcissable afin que soit formé un revêtement sur le substrat ; et (c) à appliquer une couche conductrice sur la surface d'au moins une partie de ladite composition durcie. L'invention concerne également un ensemble de circuits préparé selon ledit procédé.

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