Method for cutting a material layer by means of a cutting beam

Details Method for cutting a material layer by means of a cutting beam Method for cutting a material layer by means of a cutting beam

B - Operations, Transporting

26

F

B26F 3/00 (2006.01) B23K 26/38 (2006.01) B23Q 16/00 (2006.01) B24C 1/04 (2006.01)

Patent

CA 2725277

In the method for cutting a material layer (20) along a given cutting line (21), a cutting beam is moved so as to impinge on the material layer (20) laterally offset by a distance (W) from the cutting line (21). The distance (W) is determined as a function of the variations of the cutting speed at which the cutting beam is moved, and/or as a function of the deviations of the effective cutting beam cross-section from a circular shape.

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