B - Operations – Transporting – 26 – D
Patent
B - Operations, Transporting
26
D
B26D 7/00 (2006.01) B23K 26/00 (2006.01) B23K 26/38 (2006.01) B26D 7/08 (2006.01) H01L 51/40 (2006.01)
Patent
CA 2408096
A method and apparatus for improved cutting of an object is provided. The object can take the form of many different structures including thin formations that require cutting precision, support, and dimensional control. In accordance with one example embodiment of the present invention, the method of cutting a member uses a laser and begins with the step of providing a template removably adhered to the member. The laser then projects through the template, without intersecting with the template, to cut the member and manufacture the desired formation. The laser does not intersect with, and therefore does not cut, the template structure and cause excess laser cutting dust.
Biegelsen David K.
Swartz Lars-Erik
Sim & Mcburney
Xerox Corporation
LandOfFree
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