Method for cutting a wafer hard to cut

Details Method for cutting a wafer hard to cut Method for cutting a wafer hard to cut

B - Operations, Transporting

26

F

B26F 3/00 (2006.01) B26F 1/00 (2006.01) B28D 5/00 (2006.01) H01L 21/304 (2006.01) H01L 39/24 (2006.01)

Patent

CA 2105236

A method for cutting a wafer hard to cut into sections comprising steps of scribing the wafer so as to form a groove along a cutting line, locally heating a portion of the wafer near the groove and breaking the wafer along the groove.

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