Method for cutting bond papers

B - Operations – Transporting – 26 – D

Patent

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Details

B26D 7/01 (2006.01) B26D 7/06 (2006.01)

Patent

CA 2395853

The invention relates to a method comprising the following steps: a stack of sheets is moved under a blade in order to cut a first free strip of the stack of sheets; the first strip is cut; the stack of sheets is subsequently moved, whereupon it executes a first rotation and is guided under the blade once again in order to cut a second free strip; the second strip is cut; the stack is subsequently moved, whereupon it executes a second rotation and is guided under the blade once again in order to cut a third free strip; the third free strip and successive stacks of bond paper strips are cut, and; the successive stacks of bond paper strips are cut into individual bond papers.

L'invention concerne un procédé comprenant les étapes suivantes : une pile de feuilles est transportée sous une lame, en vue de la coupe d'une première bande libre de ladite pile de feuilles ; la première bande libre est découpée ; le transport de la pile de feuilles se poursuit, la pile de feuilles subissant une première rotation et étant à nouveau acheminée sous la lame en vue de la coupe d'une deuxième bande libre; la deuxième bande libre est découpée ; le transport de la pile de feuilles se poursuit, la pile de feuilles subissant une seconde rotation et étant à nouveau acheminée sous la lame, en vue de la coupe de la troisième bande libre; la troisième bande libre est découpée, de même que des piles de bandes de papiers-valeurs successives, et les piles de bandes de papiers-valeurs successives sont découpées en papiers-valeurs individuels.

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Profile ID: LFCA-PAI-O-2006156

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