Method for depositing a metal on a surface

Details Method for depositing a metal on a surface Method for depositing a metal on a surface

H - Electricity

05

K

96/215

H05K 3/18 (2006.01) C23C 18/16 (2006.01)

Patent

CA 1224957

UNITED STATES PATENT APPLICATION OF: YU-LING TENG RICHARD MAYERNIK FOR: IMPROVED METHOD FOR DEPOSITING A METAL ON A SURFACE Abstract of the Disclosure An improved method for making conductive metal patterns involving the steps of treating a substrate with a solution comprising a reducible salt of a non-noble metal and a light radiation sensitive reducing compound, exposing said substrate to light radiant energy, fixing with a solution comprised of a complexing agent followed by electroless depo- sition, the improvement comprising extending the bath life o said fixing solution by maintaining the concentration of the light sensitive reducing compound on the fixing solution so that it does not exceed 0.4 m moles/liter.

461667

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