Method for depositing a metallic substrate on a wall

Details Method for depositing a metallic substrate on a wall Method for depositing a metallic substrate on a wall

B - Operations, Transporting

23

K

B23K 9/04 (2006.01) B23K 9/12 (2006.01) B23K 9/16 (2006.01) B23K 9/28 (2006.01)

Patent

CA 2634859

Method for depositing a metallic substrate on a wall of a narrow depression of a metallic component, in which a wire electrode is introduced into the depression and thereby bent in the direction of the wall by means of a guide. A suitable voltage is applied to the component and to the wire electrode in order to create an arc, which melts the wire electrode in certain regions. The molten material of the wire electrode is thereby deposited on the wall of the component. The wire electrode is progressively fed in during the depositing operation.

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