H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/139, 204/91.
H01L 21/68 (2006.01) C09J 4/06 (2006.01) C09J 7/02 (2006.01) H01L 21/302 (2006.01)
Patent
CA 1252579
Abstract of the Disclosure A method for dicing a semiconductor wafer to dices which comprises: (a) placing and fixing the wafer on a dicing film which comprises a base film permeable to ultraviolet light and a layer of a pressure sensitive adhesive formed on one side of the base film to fix thereon the wafer, the adhesive comprising: (i) at least one elastic Polymer selected from the group con- sisting of polyacrylic acid ester copolymers and saturated copolyesters; (ii) an ultraviolet light polymerizable acrylic acid ester having not less than two acryloyl or methacryloyl groups in the molecule and having a molecular weight of not more than about 1000, in amounts of about 15-200 parts by weight in relation to 100 parts by weight of the elastic polymer; and (iii) a photopolymerization initiator in a sufficient amount to induce the photopolymerization of the ultraviolet light polyme- rizable acrylic acid ester; (b) dicing the wafer; (c) applying the ultraviolet light to the other side of the dicing film to substantially reduce the adhesive force of the dicing film; and then (d) removing the resultant dices from the dicing film.
501753
Kuroda Hideo
Taniguchi Masao
Bando Chemical Industry Ltd.
Fetherstonhaugh & Co.
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