Method for dismantling electronic products containing...

H - Electricity – 01 – J

Patent

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H01J 9/50 (2006.01) B23K 26/40 (2006.01)

Patent

CA 2452385

A method for dismantling electronic devices equipped with cathode-ray tubes and for recycling the materials, including stages, in which the casing is removed from the device, the detachable auxiliary device components are stripped from the tube, and the materials are cleaned and sorted. According to the invention, a point laser is used to form a groove at the splitting point, which is situated towards the front part, at a distance from the joint between the front part and the conical part, and a temperature difference is created on the different sides of the said groove to ensure the splitting of the parts, and the components thus detached are used for further purposes. If desired, the laser source is also used to remove impurities, such a glue, labels, and similar, from the outer surface of the tube.

L'invention concerne un procédé de désassemblage de dispositifs électroniques équipés de tubes cathodiques et de recyclage des matériaux, consistant à éliminer le boîtier de l'appareil, à décortiquer le tube des composants secondaires détachables du dispositif, et à nettoyer et à trier les matériaux. Selon l'invention, on utilise un laser ponctuel afin de former une rainure au point d'assemblage entre la partie avant et la partie conique, et on crée une différence de température sur les différents côtés de cette rainure afin de s'assurer de la séparation des parties, les composants ainsi détachés étant d'utilisés dans d'autres applications. Si nécessaire, on utilise aussi la source laser afin d'enlever des impuretés telles que colle, étiquettes et analogues de la surface extérieure du tube.

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