Method for electro copperplating substrates

Details Method for electro copperplating substrates Method for electro copperplating substrates

C - Chemistry, Metallurgy

25

D

C25D 21/14 (2006.01) H05K 3/24 (2006.01)

Patent

CA 2331750

A method for electro copperplating substrates, using insoluble anodes in acid copper baths and a separate supply of used copper ions. The inventive method is characterized in that the bulk of the copper ions are supplied directly without the aid of diaphragms and auxiliary electrodes in the form of copper carbonate and/or basic copper carbonate in a separate tank which is directed towards the working electrodes via a bypass, whereby the gaseous CO2 thus released is separated in the separate tank.

L'invention concerne un procédé de cuivrage électrolytique de substrats au moyen d'anodes non solubles dans des bains de cuivre acides, par acheminement séparé des ions cuivre usés. L'invention est caractérisée en ce que, sans avoir recours à des diaphragmes ni à des électrolytes auxiliaires, la majeure partie des ions cuivre est acheminée directement sous forme de carbonate de cuivre et/ou de carbonate de cuivre basique dans un réservoir séparé qui est mis en dérivation par rapport à l'électrolyte de travail, le gaz carbonique libéré étant séparé dans un réservoir séparé.

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