Method for electrodeposition of metallic multilayers

Details Method for electrodeposition of metallic multilayers Method for electrodeposition of metallic multilayers

C - Chemistry, Metallurgy

25

D

C25D 5/10 (2006.01) C25D 5/18 (2006.01)

Patent

CA 2382481

An electrodeposition method for the production of multilayer structures comprising substrates provided with layers of thin metal films of Co and Au by means of applying a current between two electrodes having a potential therebetween, immersed in a solution at least partly covering one or more substrate(s), said solution comprising Co ions and Au ions, said method comprising growing the multilayers on the substrate(s) in the solution, characterised in that the method is controlled by modulating either the current density and/or the applied potential and that the concentration of the Au ions is kept much lower than the concentration of the Co ions.

L'invention concerne un procédé de dépôt électrolytique permettant la production de structures multicouches contenant des substrats fournis par des couches minces de métal Co et Au par l'application d'un courant entre deux électrodes entre lesquelles passe un potentiel, lesquelles sont immergées dans une solution couvrant au moins partiellement un ou plusieurs substrats, ladite solution contenant des ions Co et des ions Au. Ledit procédé consiste en un tirage des multicouches sur le ou les substrats dans la solution, et est caractérisé en ce qu'il est régulé par modulation de la densité du courant et/ou du potentiel appliqué et en ce que la concentration des ions Au est maintenue beaucoup plus basse que la concentration des ions Co.

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