Method for electroless nickel plating

C - Chemistry – Metallurgy – 23 – C

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C23C 18/16 (2006.01) C23C 18/18 (2006.01) C23C 18/20 (2006.01) C23C 18/24 (2006.01) C23C 18/28 (2006.01) C23C 18/30 (2006.01) C23C 18/32 (2006.01) C23C 18/34 (2006.01) C23C 18/44 (2006.01) C23C 18/50 (2006.01)

Patent

CA 2425575

A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selectively coat the substrates to be treated only, and not the surfaces of the racks. The method involves the following steps: a. pickling the surfaces with a solution containing chromate ions; b. activating the pickled surfaces with a silver colloid containing stannous ions; c. treating the activated surfaces with an accelerating solution in order to remove tin compounds from the surfaces; and d. depositing, by means of an electroless nickel plating bath, a layer that substantially consists of nickel to the surfaces treated with the accelerating solution, the electroless nickel plating bath containing at least one reducing agent selected from the group comprising borane compounds.

Cette invention concerne un procédé de dépôt autocatalytique sur des substrats présentant plus spécialement des surfaces électriquement non conductrices. Avec ce procédé, il est possible d'effectuer sur des substrats des dépôts métalliques pour un coût réduit et en conditions de fabrication, et d'exécuter ces dépôts sélectivement, sur les seul substrats à traiter et non sur les surfaces des claies. Le procédé englobe les opérations suivantes : (a) décapage des surfaces au moyen d'une solution renfermant des ions chromate ; (b) activation des surfaces décapées au moyen d'un colloïde d'argent renfermant des ions stanneux ; (c) traitement des surfaces activées au moyen d'une solution accélératrice destinée à faire disparaître les composés étain des surfaces : et (d) dépôt, dans un bain de nickelage autocatalytique, d'une couche composée essentiellement de nickel sur les surfaces traitées au moyen de la solution accélérante, ledit bain de nickelage contenant au moins un agent réducteur pris dans le groupe comprenant des composés borane.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Method for electroless nickel plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for electroless nickel plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for electroless nickel plating will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1731343

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.