Method for electroplating non-metallic surfaces

Details Method for electroplating non-metallic surfaces Method for electroplating non-metallic surfaces

C - Chemistry, Metallurgy

25

D

204/12, 204/18

C25D 7/12 (2006.01) C25D 5/54 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1226846

ABSTRACT Method for electroplating non-metallic surfaces on a substrate, e.g. of plating holes in metal clad laminates, is disclosed. Metallic sites are formed on the surface and the resulting site-containing surface is electroplated with an electroplating bath comprising a component which causes the plating to preferentially occur at these sites as opposed to the plating on surfaces of the same metal as the one plated out; whereby a rate differential of the plating-reaction on site-surfaces is achieved with respect to the plating-reaction on a surface consisting of the metal to be plated out. The metal deposited is different from the metal existing at the deposition surface.

431423

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