Method for encapsulating an electronic arrangement

Details Method for encapsulating an electronic arrangement Method for encapsulating an electronic arrangement

H - Electricity

05

K

H05K 5/06 (2006.01) G02B 6/12 (2006.01) H01L 23/29 (2006.01)

Patent

CA 2678273

The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure- sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.

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