H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/167
H01L 25/00 (2006.01) H01L 21/56 (2006.01) H01L 21/60 (2006.01) H01L 23/31 (2006.01)
Patent
CA 1232372
ABSTRACT OF THE DISCLOSURE Described herein is a method for-encapsulating components (1) on a carrier tape (2), particulary semiconductor compo- nents, with a polymer (15, 15') or similar material, which components are supported by their lead electrodes under a hole (20) on the carrier tape. According to the invention, a film material (8) coated with a cement layer is formed into a cup- shaped structure so that the cement layer is located on the inner side of the structure (9, 10). The bottom (10) of the cup-shaped structure (9, 10) is covered with a molding layer (15), preferably a polymer layer, and the cup-shaped struc- ture is placed in the hole so that its rims (9) extend over the edges of the hole and the component (1) is brought into contact with the molding layer (15). In the next phase, the other side of the component (1) is covered with a protective layer (15'), preferably a polymer layer, which extends over the edges of the component (1), contacting the molding layer (15), and, furthermore, the cup-shaped structure (9, 10) is bonded at its rims to the carrier tape by pressing and heating. Finally, the molding layer (15) and the protective layer (15') are subjected to heat treatment so that they en- close the component (1) during a curing cycle. The cup- shaped structure (9, 10) prevents the protective polymer from spreading outside the desired area and gives the encap- sulation a clearly defined shape. (Figure 13)
490925
Kirby Eades Gale Baker
Oy Lohja Ab
LandOfFree
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