H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/053 (2006.01)
Patent
CA 2653918
The invention relates to the field of electronic components and the integrated driver circuits and/or control circuits assigned thereto, more particularly to the mechanical encasing of electronic components and the encasing of electronic components and the associated integrated driver circuits and/or control circuits thereof.
La présente invention a trait au domaine des composants électroniques et des circuits intégrés pilotes et/ou circuits intégrés de commande qui leurs sont associés, et en particulier à l'encapsulation mécanique de composants électroniques et l'encapsulation de composants électroniques et des circuits intégrés pilotes et/ou circuits intégrés de commande qui leurs sont associés.
Leib Juergen
Yamamoto Hidefumi
Kirby Eades Gale Baker
Schott Ag
LandOfFree
Method for encasing electronic components and integrated... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for encasing electronic components and integrated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for encasing electronic components and integrated... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1453682