Method for engraving materials using laser etched v-grooves

Details Method for engraving materials using laser etched v-grooves Method for engraving materials using laser etched v-grooves

B - Operations, Transporting

23

K

B23K 26/08 (2006.01) B23K 26/40 (2006.01) C03C 19/00 (2006.01) C03C 23/00 (2006.01) G02B 6/25 (2006.01)

Patent

CA 2424442

Disclosed is a method for engraving materials such as fused silica or ceramic by continuously actuating a laser producing a Gaussian beam, directing the beam towards the surface of the substrate and moving the beam relative to the surface of the substrate so that a V-groove is obtained by laser ablation of the substrate. The depth of the groove, the ankle of the top of the groove, can be controlled by the relative speed between the laser beam and the substrate, the power density and the width of the laser beam, the polarization of the laser beam and the incident angle of the laser beam with respect to the surface. A method for treating an optical fiber connector is also disclosed.

La présente porte sur une méthode de gravure de matériaux comme de la céramique ou de la silice fondue en actionnant en continu un laser produisant un faisceau gaussien, en dirigeant le faisceau vers la surface du substrat et en le déplaçant par rapport à la surface du substrat de façon à obtenir une rainure en V par l'ablation par laser du substrat. La profondeur de la rainure, la cheville de la partie supérieure de la rainure, peut être contrôlée par la vitesse relative entre le faisceau laser et le substrat, la densité de puissance et la largeur du faisceau laser, la polarisation du faisceau laser et l'angle incident du faisceau laser par rapport à la surface. La présente porte aussi sur une méthode de traitement d'un connecteur de fibre optique.

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