Method for enhancing hard material mounting surfaces

B - Operations – Transporting – 23 – B

Patent

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Details

B23B 27/20 (2006.01) B23K 26/08 (2006.01) B24D 18/00 (2006.01)

Patent

CA 2311516

A process for enhancing the mounting surface of a hard surface comprises rotating a hard material having a planer mounting surface about an axis perpendicular to its surface and intercepting said surface with a laser beam directed along an axis which is at an angle to the surface's rotating axis. The laser beam cuts a void through the rotating mounting surface and into the material, creating an undercut for enhanced mechanical bonding properties. By repositioning the relative positions of the laser beam and rotating surface, a plurality of different undercut voids can be formed. Preferably the laser beam can be pulsed and synchronized with the speed of rotation of the surface for cutting a pattern of undercut voids in the surface. Apparatus comprises a rotating plate to which the material is temporarily affixed, a drive for rotating the affixed mounting surface in its plane and a laser which emits a laser beam along an axis which intercepts the mounting surface and which is angled from the plate's axis of rotation. A controller and a two dimensional actuator control the relative coordinates of the intercept of the laser beam and mounting surface. Preferably the speed of the drive is variable for ensuring the lineal speed of the mounting surface intercepted by the laser beam is maintained at or below a predetermined speed.

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