Method for enhancing the solderability of a surface

Details Method for enhancing the solderability of a surface Method for enhancing the solderability of a surface

C - Chemistry, Metallurgy

25

D

C25D 3/46 (2006.01) C23C 18/42 (2006.01) C25D 5/48 (2006.01) H05K 3/24 (2006.01)

Patent

CA 2423066

A process for enhancing the solderability of a surface, particularly copper surfaces upon printed circuit boards, is disclosed. The surface is plated using a silver plating solution. The plated surface is then further treated with a solution that comprises an organic heterocyclic mercapto compound and most preferably an alkali metal hydroxide.

L'invention porte sur un procédé améliorant la soudabilité d'une surface, en particulier d'une surface de cuivre, sur une plaquette de circuit imprimé, selon lequel la surface est plaquée à l'aide d'une solution d'argent, puis traitée avec une autre solution consistant en un composé mercapto hétérocyclique organique, ou mieux en un hydroxyde de métal alcalin.

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