Method for enhancing the uniform electroless deposition of...

C - Chemistry – Metallurgy – 23 – C

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C23C 18/42 (2006.01) C23C 18/44 (2006.01) H05K 3/24 (2006.01)

Patent

CA 2076088

It has been found that the prior activation of a palladium substrate, such as palladium electrolessly deposited onto nickel, in an aqueous solution of an alkali metal hydroxide, an alkali metal carbonate and a reducing agent, for example, dimethylamine borane, can provide an enhancement in the thickness and uniformity of electrolessly deposited gold when the activated substrate is placed in an electroless gold bath.

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