C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 18/42 (2006.01) C23C 18/44 (2006.01) H05K 3/24 (2006.01)
Patent
CA 2076088
It has been found that the prior activation of a palladium substrate, such as palladium electrolessly deposited onto nickel, in an aqueous solution of an alkali metal hydroxide, an alkali metal carbonate and a reducing agent, for example, dimethylamine borane, can provide an enhancement in the thickness and uniformity of electrolessly deposited gold when the activated substrate is placed in an electroless gold bath.
Company General Electric
Craig Wilson And Company
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