Method for epitaxial lift-off for oxide films and resultant...

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H01L 39/24 (2006.01) C04B 35/45 (2006.01) C04B 35/622 (2006.01) C30B 25/18 (2006.01) H01L 39/00 (2006.01) G02F 1/00 (2006.01)

Patent

CA 2175826

A method utilizing layered copper oxide release materials to separate oxide films from the growth substrates. The method of forming free standing oxide films comprises the steps of: first forming a copper oxide release material, (12), such as a high temperature superconductor, YBCO, on a growth substrate (10), such as LaAlO3, second, forming an oxide film, (14) on the copper oxide release material, and third, preferentially etching away the copper oxide release material (12) to separate the oxide film (14) from the substrate (10). The oxide film (14) can be a ferroelectric or an optical material, or a material that is compatible with further high temperature superconductor growth, such as SrTiO3 or CeO2.

Procédé recourant à des couches d'oxyde de cuivre de séparation pour séparer des films d'oxyde de leur substrat de croissance. Le procédé d'obtention de films d'oxyde indépendants comprend les étapes suivantes: former une couche d'oxyde de cuivre (12) de séparation, tel qu'un supraconducteur à haute température de type YBCO, placé sur un substrat de croissance (10) tel que du LaAlO¿3?, former ensuite un film d'oxyde (14) sur la couche d'oxyde de cuivre de séparation, puis attaquer chimiquement la couche d'oxyde de cuivre (12) pour séparer le film d'oxyde (14) du substrat (10). Le film d'oxyde (14) peut consister en un matériau présentant des propriétés ferroélectriques ou optiques, ou en un matériau compatible avec une nouvelle croissance de supraconducteur à haute température, tel que le SrTiO¿3? ou le CeO¿2?.

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