Method for fabricating ultra-narrow metallic lines

Details Method for fabricating ultra-narrow metallic lines Method for fabricating ultra-narrow metallic lines

C - Chemistry, Metallurgy

23

F

356/176, 356/178

C23F 1/02 (2006.01) C23C 14/48 (2006.01) H01L 21/768 (2006.01) H01L 39/24 (2006.01)

Patent

CA 1092727

METHOD FOR FABRICATING ULTRA-NARROW METALLIC LINES ABSTRACT OF THE DISCLOSURE A method for fabricating very narrow superconducting metallic lines on a substrate using ion-implantation and etching techniques. The method permits lines to be produced which are much smaller than those fabricated by conventional masking and etching techniques. It makes the fabrication of very small Josephson and other superconducting devices possible. Also since lines are formed in metals, they have high conductivity, so are useful as ordinary conductors at high temperature or when the technique is utilized with non-superconducting materials. The method includes the steps of depositing a selected metal film on a substrate, applying a photoresist or other masking pattern and exposing, etching away the exposed region, ion-implanting the edge of the resulting pattern, removing the photoresist and etching away the unimplanted portion of the metal leaving an ultra-narrow line pattern.

292938

Affiliated with

Also associated with

Rating

Method for fabricating ultra-narrow metallic lines does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating ultra-narrow metallic lines, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating ultra-narrow metallic lines will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-773257