Method for firing ceramic thick film circuits with...

G - Physics – 03 – C

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G03C 1/76 (2006.01) C04B 35/65 (2006.01) C04B 41/00 (2006.01) C04B 41/51 (2006.01) C04B 41/52 (2006.01) C04B 41/80 (2006.01) C04B 41/88 (2006.01) C04B 41/89 (2006.01) H01L 21/48 (2006.01) H01L 21/84 (2006.01) H01L 23/498 (2006.01) H05K 3/12 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2051842

ABSTRACT A method for heat processing of ceramic articles bearing conductive metal patterns applied in conductive pastes including a photo-imageable binder, comprises heating under conditions to promote initial binder burn-out, and thereafter to sinter the conductor composite to form the final ceramic article. The invention is characterized by the presence of moisture in an amount of from about 0.25% to about 2% by volume of the gaseous atmosphere at at least the sintering stage, and preferably at both the binder burn-out stage and the sintering stage. Optionally, up to about 10 ppm, and preferably from about 2 ppm to about 3 ppm H2 may be included, and in a further embodiment, the main gas may be N2. Conductive ceramic articles heat treated with this atmosphere exhibit a combination of improved properties, including acceptable cohesion of the metallic pattern and adhesion thereof to the ceramic substrate, in combination with improved conductivity and dielectric properties. Optional catalytic generation of the moisture containing heating atmosphere may also be utilized.

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