Method for forming a high-voltage / high-power die package

Details Method for forming a high-voltage / high-power die package Method for forming a high-voltage / high-power die package

H - Electricity

01

L

H01L 23/498 (2006.01) H01L 21/60 (2006.01)

Patent

CA 2529272

A method for forming a high voltage component package, which includes providing a flexible non-conductive substrate, forming a conductive layer on the substrate, and forming a circuit trace from the conductive layer, the circuit trace having frangible leads. A first side of a component overlies at least a portion of the circuit trace, and the component is coupled to the circuit trace by breaking a frangible lead on the trace and bonding the lead to the component. The flexible substrate is then bent or folded such that another portion of the circuit trace is in proximity to a second side of the component. The trace is coupled to the second side of the component either with a conductive adhesive or by bonding with another frangible trace.

Procédé servant à fabriquer un boîtier de composants électroniques haute tension, ce qui consiste à mettre en application un substrat souple non conducteur, à créer une couche conductrice sur ce substrat et à créer une trace de circuit à partir de la couche conductrice, cette trace de circuit possédant des fils de connexion cassables. Un premier côté d'un composant recouvre au moins une partie de la trace de circuit et ce composant est couplé à ladite trace par rupture d'un fil de connexion cassable sur la trace et fixation de ce fil au composant. On incurve ou on plie ensuite le substrat souple, de sorte qu'une autre partie de la trace de circuit se trouve à proximité d'un deuxième côté du composant. On couple cette trace au deuxième côté du composant, soit au moyen d'un adhésif conducteur, soit par liaison avec une autre trace cassable.

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