Method for forming adhesive layer

B - Operations – Transporting – 05 – D

Patent

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Details

B05D 1/26 (2006.01) C09J 5/00 (2006.01)

Patent

CA 2528491

An adhesive layer forming method capable of forming an adhesive layer to a specified thickness in a step for forming the adhesive layer on the surface of a member to be treated for forming a film containing powder in the member to be treated. An adhesive layer forming medium (m1) coated with an adhesive substance is collided with the member to be treated (W) to move the adhesive substance from the adhesive layer forming medium (ml) to the member to be treated (W) to form the adhesive layer on the member to be treated (W). The adhesive layer formed on the member to be treated can be formed to the specified thickness by adjusting the thickness of the adhesive substance (amount of the adhesive substance held by each of the adhesive layer forming medium) applied onto the adhesive layer forming medium. Thus, a finally formed powder film can also be formed in a specified thickness.

L'invention concerne un procédé de formation de couche adhésive permettant de former une couche adhésive d'une épaisseur spécifique au cours d'une étape de formation de couche adhésive sur la surface d'un élément à traiter en vue de former un film contenant de la poudre dans l'élément à traiter. Une matière de formation de couche adhésive (m1) revêtu d'une substance adhésive rencontre l'élément à traiter (W) afin de déplacer la substance adhésive de la matière de formation de couche adhésive (m1) vers l'élément à traiter (W) en vue de former la couche adhésive sur l'élément à traiter (W). La couche adhésive formée sur l'élément à traiter peut être formée d'une épaisseur particulière par réglage de l'épaisseur de la substance adhésive (quantité de substance adhésive contenue dans chacun des matières de formation de couche adhésive) appliquée sur la matière de formation de couche adhésive. Ainsi, un film en poudre peut également être formé en une épaisseur particulière.

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