H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/04 (2006.01) H05K 3/28 (2006.01)
Patent
CA 2314049
At least one conductive circuit 46 is formed on a substrate 12 that has a conductive layer 28 and a cover layer 40 bonded thereto. The conductive circuit 46 is formed by the severing of the conductive layer 28 into a conductive circuit 46 and a remaining portion 48 by a cutting edge of a cutting tool 50. The edge of the tool also causes the severed edges of the conductive path and the remaining portion to form a gap 52. An electrical insulating coating 54 covers the cover layer while filling the gaps 52. The insulator coating 54 is allowed to set for maintaining separation and integrity of the conductive path 46. The method of the present invention lends itself to manual, semi-automatic and/or automatic production of discrete articles.
Gill Peter L.
Ramsey Joseph W.
Gill Peter L.
Ramsey Joseph W.
Ridout & Maybee Llp
LandOfFree
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