C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 22/52 (2006.01) C23C 22/78 (2006.01) C23F 17/00 (2006.01)
Patent
CA 2045919
ABSTRACT OF THE DISCLOSURE A method for artificially forming patina on copper comprising: a) removing any impurity present on the surface of copper substrate; b) polishing the copper substrate with an aqueous solution containing sodium ions, copper ions, acetate ions, chlorine ions, sulphate ions, H+ ions and an OH- ions until a brown colour is obtained; c) washing the polished copper substrate having brown colour of step (b), with water and drying; d) gently brushing the copper substrate having been dried according to step (c), washing and thoroughly drying; e) submitting the copper substrate after having been thoroughly dried according to step (d), to a filtered aqueous solution containing copper carbonate, ammonium chloride, copper acetate, arsenic trioxide, copper nitrate and hydrochloric acid until the desired patinated copper substrate is obtained. The invention covers also the products resulting from the method, as well as specific solutions to carry steps (b) and (e).
Fumigation Maritime Ltee
Robic
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