Method for forming film

H - Electricity – 01 – L

Patent

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Details

H01L 21/316 (2006.01) C23C 16/40 (2006.01) C23C 16/452 (2006.01) H01L 21/314 (2006.01) H01L 21/318 (2006.01)

Patent

CA 2326052

In a film-forming process comprising depositing a molecule composed of a plurality of atoms on a substrate or reacting the molecule with an atom in the substrate to produce a compound, an improvement which comprises generating plasma in an atmosphere of a mixed gas of the molecule with an inert gas having a metastable energy level higher than the energy required for transferring the molecule to an atomic state, to thereby dissociate the molecule into atoms in advance prior to forming a film. This eliminates the need for dissociation of the molecule on the substrate and allows the practice of the film-forming process at a low temperature.

L'invention concerne un procédé permettant de former un film, qui consiste à déposer une molécule constituée d'une pluralité d'atomes sur un substrat ou à la faire réagir avec un atome de ce dernier, de façon à produire un composé. Afin d'améliorer le procédé, on génère du plasma dans une atmosphère de gaz mixte constitué de la molécule et d'un gaz inerte ayant un niveau énergétique métastable supérieur à l'énergie nécessaire pour faire passer la molécule à un état atomique, de façon à dissocier la molécule en atomes avant de former un film. De cette manière, il n'est pas nécessaire de dissocier la molécule sur le substrat et il est possible d'effectuer l'opération de formation de film à basse température.

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