Method for forming microstructures on a substrate using a mold

Details Method for forming microstructures on a substrate using a mold Method for forming microstructures on a substrate using a mold

H - Electricity

01

J

H01J 9/24 (2006.01) C03C 17/00 (2006.01) C03C 17/22 (2006.01)

Patent

CA 2462088

In a method of making a microstructured assembly, a substantially uniform coating of a curable material is formed on a substrate with the coating defining a leading edge. The coating is contacted with a mold starting at the leading edge to form in the curable material a plurality of barrier regions connected by intervening land regions. The curable material is cured and the mold is removed. Optionally, the coating includes a binder. Such a coating can optionally be debinded. In addition, the coating can be fired to form ceramic microstructures.

Pour la réalisation d'un ensemble à microstructures, on dépose un revêtement sensiblement sensiblement uniforme d'un matériau durcissable, ledit revêtement définissant un bord menant. A partir de ce bord menant, le revêtement est mis en contact avec un moule qui permet de former dans le matériau durcissable une pluralité de régions d'arrêt reliées par des zones de cordon intermédiaires. Le moule est retiré après durcissement du matériau. Le revêtement peut éventuellement renfermer un liant. De plus, le revêtement peut être soumis à une cuisson pour la formation de microstructures céramiques.

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