Method for forming through holes in a polyimide substrate

Details Method for forming through holes in a polyimide substrate Method for forming through holes in a polyimide substrate

H - Electricity

05

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356/18, 327/1.6

H05K 3/00 (2006.01) B23K 26/38 (2006.01) B23K 26/40 (2006.01) H01L 21/311 (2006.01) H05K 1/03 (2006.01) H05K 3/42 (2006.01)

Patent

CA 2030763

15 TITLE METHOD FOR FORMING THROUGH HOLES IN A POLYIMIDE-SUBSTRATE ABSTRACT OF THE DISCLOSURE Hole formation in a polyimide substrate employs a carbon dioxide laser.

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