Method for gluing of particles containing chips, fibers and...

B - Operations – Transporting – 27 – N

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

32/85

B27N 1/02 (2006.01)

Patent

CA 1154246

ABSTRACT OF THE DISCLOSURE A method for gluing of chips, fibers, and similar ligno-cellular containing particles which are discharged falling free in a vertical chute and being subjected at least partially to rotational forces during the downward movement thereof, being glued and thereafter being discharged from the chute, characterized thereby that the chips during the free-fall thereof are collected into a rotating chip material ring and after at least substantial formation of the chip material ring being glued and that directly subsequently chips of the at least substantially formed chip material ring are subjected to components of movement directed upwardly in such a manner that the chip mater- ial ring is stopped in the downward movement thereof. A gluing machine for carrying out the foregoing method includes at least one substantially vertical chute with a circular-shaped cross section, an upper chip inlet and a chip outlet or discharge located therebelow as well as having pipes or tubes and also pump means for supplying glue and having rotating tools influencing the movement of the chips, characterized thereby that the drum-shaped chute has a shaft rotating at high speed passing therethrough upon which chip ring forming tools are arranged above in the region of the incoming chips and therebelow brake tools are arranged stopping the downward movement of the chips and that the chip inlet provides a directional component parallel to the rotational axis of the shaft and the chip outlet is arranged at the lower end of the chute.

376216

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Method for gluing of particles containing chips, fibers and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for gluing of particles containing chips, fibers and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for gluing of particles containing chips, fibers and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-237426

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.