H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 5/06 (2006.01) G02B 7/00 (2006.01) H01S 5/022 (2006.01)
Patent
CA 2485498
The invention relates to a method for producing a housing body or at least parts of a housing body, especially for encapsulating optoelectronic components. According to the inventive method, a housing element is joined to a preferably metallic housing structure, and the housing element and the housing structure are brought into contact by means of a glass solder. The aim of the invention is to enable a reliable, cost-effective and preferably hermetic join to be created between the metallic sleeve and the sheet of glass. To this end, the glass solder is applied as a mouldable mass, especially as a paste, before the housing element and housing structure are joined; the glass solder is pre-vitrified and fixed in its shape by means of at least one single energy input, especially by burning out organic constituents; and once the housing element has been inserted into the housing structure, an at least partially hermetic join is created between the sheet of glass and the housing structure by means of heating.
La présente invention concerne un procédé pour réaliser un corps de boîtier ou au moins des parties d'un corps de boîtier, notamment pour réaliser un enrobage de composants optoélectroniques. Ledit procédé comprend l'assemblage d'un élément de boîtier et d'une structure de boîtier de préférence métallique et la mise en contact de l'élément de boîtier et de la structure de boîtier avec une brasure de verre. L'invention a pour objet de permettre la formation d'une liaison de préférence hermétique, fiable et économique entre gaine métallique et plaque de verre. A cet effet: la brasure de verre est appliquée en tant que masse déformable, notamment en tant que pâte, avant l'assemblage de l'élément de boîtier et de la structure de boîtier; au moins un simple apport d'énergie, notamment la combustion de composants organiques, sert à vitrifier la brasure de verre et à établir sa forme définitive; et, après mise en place de l'élément de boîtier dans la structure de boîtier, un chauffage permet la formation d'une liaison hermétique au moins par zone entre la plaque de verre et la structure de boîtier.
Hammer Bernd
Hettler Robert
Mayer Markus
Mund Dietrich
Sausenthaler Edeltraud
Kirby Eades Gale Baker
Schott Ag
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