Method for hermetically sealing an electronic circuit package

Details Method for hermetically sealing an electronic circuit package Method for hermetically sealing an electronic circuit package

H - Electricity

01

L

18/63

H01L 25/065 (2006.01) H01L 21/52 (2006.01) H01L 23/10 (2006.01) H01L 23/20 (2006.01)

Patent

CA 1081411

METHOD FOR HERMETICALLY SEALING AN ELECTRONIC CIRCUIT PACKAGE ABSTRACT OF THE DISCLOSURE A hermetically sealed electronic circuit package is formed by placing a preformed, uncured sealant between a circuitized ceramic substrate and a ceramic cover. The resultant assembly is placed in an evacuated oven which is preheated to a temperature at least as great as the curing temperature of the sealant. Before the sealant reaches its melting temperature, the oven is backfilled with nitrogen and stabilized at atmospheric pressure. The assembly is maintained in the heated environment for a suf- ficient period of time to substantially cure the sealant. The resulting assembly may be opened to affect any repairs that may become necessary and then reassembled.

268609

Affiliated with

Also associated with

Rating

Method for hermetically sealing an electronic circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for hermetically sealing an electronic circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for hermetically sealing an electronic circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-111807