B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
B29C 47/00 (2006.01) B29C 55/02 (2006.01) B65C 9/18 (2006.01)
Patent
CA 2094146
2094146 9206836 PCTABS00011 Extruded heat-set polymeric films are die-cut into labels (34), dispensed past peel-back edges (38), and applied to deformable or squeezable workpieces (36) afer being treated differently in their lengthwise and cross directions so as to have different stiffnesses in the respective directions and achieve a tradeoff between dispensability and conformability superior to that of prior art labels of heat-set polymeric material. In one particular respect, unilayer polyethylene is treated differently in machine and cross directions to yield improved heat-set polyethylene labels (34).
Avery Dennison Corporation
Macrae & Co.
LandOfFree
Method for high speed labelling of deformable substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for high speed labelling of deformable substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for high speed labelling of deformable substrates will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1556492