Method for i.a. measuring the thickness of plate...

G - Physics – 01 – S

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Details

G01S 15/89 (2006.01) G01B 17/02 (2006.01) G01N 29/07 (2006.01) G01N 29/265 (2006.01) G01S 15/10 (2006.01) G01S 15/88 (2006.01)

Patent

CA 2159708

It is described a method for automatic state control, inspection, cleaning and/or surface treatment of structures, especially measuring the thickness of plate constructions and pipes by means of ultrasound signals from a self propelled, remotely controllable unit (1). The self propelled unit (1) is continuously moved in the measurement area, and a transmitter (6) transmits an ultrasound signal in a direction substantially perpendicular to the surface of the construction. A reflected signal is received by a receiver (6), determining thickness and material quality of the construction at the measurement spot, on the basis of received reflected signal, and parameters such as transit time for the reflected signal. The self-propelled unit (1) performs self- positioning by means of previously known spots on the construction. All received data regarding waveform of the reflected signal is stored in a computer, and thickness and material quality are verified by comparing data for received signal in one spot, with data for received signals in adjacent spots. The steps are repeated for collection of data for new measurement spots.

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