Method for improving electric conductivity of a resin molding

H - Electricity – 01 – B

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18/1166, 31/156,

H01B 1/12 (2006.01) B29C 43/00 (2006.01) B29C 47/44 (2006.01) B29C 59/14 (2006.01) C08G 65/26 (2006.01) C08L 71/02 (2006.01)

Patent

CA 2025215

ABSTRACT OF THE DISCLOSURE A resin molding having a significantly improved electric conductivity is obtained by mixing with a resin, a complex of a polyether and an electrolyte salt soluble in the polyether, molding the mixture and then treating the resultant molding with plasma. The polyether is selected from the group consisting of alkylene oxide polymers and copolymers, preferably selected from the group consisting of polymers of alkylene oxide having not less than 4 carbon atoms and block or random alkylene oxide copolymers containing not less than about 10% by weight of at least one alkylene oxide unit having not less than 4 carbon atoms.

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