Method for improving insulation resistance of printed circuits

Details Method for improving insulation resistance of printed circuits Method for improving insulation resistance of printed circuits

C - Chemistry, Metallurgy

23

F

356/12, 149/8

C23F 4/00 (2006.01) H05K 3/26 (2006.01) H05K 3/06 (2006.01) H05K 3/10 (2006.01)

Patent

CA 2022400

ABSTRACT OF THE DISCLOSURE After the etching away of copper to selectively expose surface areas of insulating material in a printed circuit process based upon copper foil-clad insulating substrate material, the exposed surface areas of insulating material are contacted with an aqueous alkaline permanganate solution to remove from the areas residual metal species associated therewith so as to improve the electrical resistance afforded by those areas in the printed circuit.

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