Method for improving metal adhesion to polyimide surfaces

Details Method for improving metal adhesion to polyimide surfaces Method for improving metal adhesion to polyimide surfaces

C - Chemistry, Metallurgy

23

C

117/80, 117/90

C23C 18/20 (2006.01) C23C 18/22 (2006.01) C23C 18/28 (2006.01) C23C 18/38 (2006.01) H05K 3/00 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2031422

ABSTRACT OF THE DISCLOSURE The adhesion between surfaces of polyimide, parti- cularly the through hole surfaces of polyimide-based multilayer laminates used in the fabrication of multi- layer printed circuits, is improved by pretreatment of the surfaces with an essentially non-alkaline aqueous permanganate solution.

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